JPS63136656A - 電子回路パツケ−ジの放熱構造 - Google Patents

電子回路パツケ−ジの放熱構造

Info

Publication number
JPS63136656A
JPS63136656A JP61283245A JP28324586A JPS63136656A JP S63136656 A JPS63136656 A JP S63136656A JP 61283245 A JP61283245 A JP 61283245A JP 28324586 A JP28324586 A JP 28324586A JP S63136656 A JPS63136656 A JP S63136656A
Authority
JP
Japan
Prior art keywords
heat
tube
lsis
cooling
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61283245A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0573268B2 (en]
Inventor
Minoru Okano
岡野　実
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP61283245A priority Critical patent/JPS63136656A/ja
Publication of JPS63136656A publication Critical patent/JPS63136656A/ja
Publication of JPH0573268B2 publication Critical patent/JPH0573268B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP61283245A 1986-11-28 1986-11-28 電子回路パツケ−ジの放熱構造 Granted JPS63136656A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61283245A JPS63136656A (ja) 1986-11-28 1986-11-28 電子回路パツケ−ジの放熱構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61283245A JPS63136656A (ja) 1986-11-28 1986-11-28 電子回路パツケ−ジの放熱構造

Publications (2)

Publication Number Publication Date
JPS63136656A true JPS63136656A (ja) 1988-06-08
JPH0573268B2 JPH0573268B2 (en]) 1993-10-14

Family

ID=17662967

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61283245A Granted JPS63136656A (ja) 1986-11-28 1986-11-28 電子回路パツケ−ジの放熱構造

Country Status (1)

Country Link
JP (1) JPS63136656A (en])

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0992994A (ja) * 1995-09-21 1997-04-04 Asia Electron Inc 冷却板
WO2013011636A1 (ja) * 2011-07-20 2013-01-24 ダイキン工業株式会社 冷媒配管の取付構造
EP2122745B1 (de) * 2007-02-22 2014-09-03 Rohde & Schwarz GmbH & Co. KG Hochlastkoppler

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0992994A (ja) * 1995-09-21 1997-04-04 Asia Electron Inc 冷却板
EP2122745B1 (de) * 2007-02-22 2014-09-03 Rohde & Schwarz GmbH & Co. KG Hochlastkoppler
WO2013011636A1 (ja) * 2011-07-20 2013-01-24 ダイキン工業株式会社 冷媒配管の取付構造
US9784506B2 (en) 2011-07-20 2017-10-10 Dakin Industries, Ltd. Refrigerant pipe attachment structure

Also Published As

Publication number Publication date
JPH0573268B2 (en]) 1993-10-14

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